3D Interferometric-Sensors
nXI-5ST
Stand Alone type(Table top)3D Interference Measurement System
A diverse lineup at reasonable prices.
The high-level measurement technology provides high reliability for results and
maximizes user convenience by offering various parameters such as 3D height,
roughness, and more.
Furthermore, it is a product designed for companies (schools and analysis laboratories) hesitant to adopt due to budget constraints. While maintaining the performance of existing white light interferometers, it is easy for anyone to use at a
reasonable price.
Application
Wafer Bumps
Roughness
PCB Bumps
PCB Hole
Specifications
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You can experience the technology of Nexensor.
You can experience the technology of Nexensor.
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| Measuring model | Measuring technology | Test content | Measuring data |
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Large-area measurement with WSI interferometers FOV extensive application | Micro Bump Height Monolayer membrane thickness measurement PCB fine pattern Processed surface roughness measurement Sensor step-difference measurement |
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Free-Form Metrology
Divided inspection possible according to product curve angels
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Inspection of lens and glass, and measurement of shapes
Inspection of OLED surfaces, and measurement of shapes
Inspection of wafer surfaces, and measurement of shapes
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Real-time measurement of transparent and semitransparent product thickness
Applicable to multi-channels
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Measurement of wafer(silicone, sapphire) thickness
Measurement of glass and film thickness
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