3D Free-Form Measuring
Freeform surface
measuring system
3D surface shape measurement of products
with various curved & specular/rough surfaces
nXF-3 is the world’s first product to measure the warp & bow
of highly reflective or transparent products such as wafers
and films by applying ‘deflectometry’.
By providing quantitative and accurate measurement values
as well as the surface shape of products, it improves process stabilization
and efficiency. In addition, it can measure and inspect the surface shape of
various specular materials to measure warpage and dents on the film surface,
secondary battery pouch, hydrogen battery thin plate, automobile paint,
and so on, with high reliability.
Key Features
· Inspection of shiny
or transparent product surfaces
· Various FOVs applied
· Applicable to the mass production line
· High precision
· Simple measuring process
· Various data analysis
· Easy user interface
The world’s first wafer
hard face/rough face.
development of simultaneous
measurement technology.
Wheel Mark
Wafer Warpage
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Measuring model Measuring technology Test content Measuring data
Large-area measurement with WSI interferometers
FOV extensive application
Micro Bump Height
Monolayer membrane thickness measurement
PCB fine pattern
Processed surface roughness measurement
Sensor step-difference measurement
Free-Form Metrology
Divided inspection possible according to product curve angels
Inspection of lens and glass, and measurement of shapes
Inspection of OLED surfaces, and measurement of shapes
Inspection of wafer surfaces, and measurement of shapes
Real-time measurement of transparent and semitransparent product thickness
Applicable to multi-channels
Measurement of wafer(silicone, sapphire) thickness
Measurement of glass and film thickness